Compact conduction model of ball grid array packages

This work focuses on the application of compact conduction model (CCM) creation approach to ball grid array (BGA) packages under steady state conditions. The procedure of creating CCM from detailed BGA model is demonstrated. The authors have imposed realistic boundary condition scenarios that are likely to test the boundary condition independence necessary for the compact modeling approach. Results showed acceptable agreement in die temperature and heat flow predictions from simulations using detailed BGA models and their CCM equivalents.