Influence of substrate temperature on surface structure and electrical resistivity of the evaporated tin sulphide films

Tin sulphide films have been deposited with an average thickness of 0.5 mm at different substrate temperatures. The surface structure and electrical resistivity of the films were investigated at room temperature. The surface profiles were examined for crystallite size and roughness with respect to substrate temperature. The as-deposited films grown at low temperatures exhibited blurred hill shape grains with an average diameter and roughness of 85 and 14.5 nm, respectively. However, the films grown at higher temperatures showed nice square shape grains with an average size of 180 nm and roughness of 5.12 nm. More crystalline tin sulphide films showed a lower electrical resistivity of 29.9 V cm than other films.