Ir-based diffusion barriers for Ohmic contacts to p-GaN

Ir-based electrical contacts to p-type GaN have been fabricated and characterized. Both GaN//Ni/Au/Ir/Au and GaN//Ni/Ir/Au contact structures were deposited, however, only the former produced Ohmic current–voltage characteristics. At an anneal temperature of 500 °C, the Ni/Au/Ir/Au contact had a specific contact resistance of ∼2 × 10−4 Ω cm2, comparable or superior to conventional Ni/Au contacts that are less thermally stable. Anneal temperatures above 500 °C caused the Ir-based contact to fail. Auger electron spectroscopy was used to obtain depth profiles of both types of contacts at a variety of temperatures in order to provide insight into the mechanism of Ohmic formation as well as potential reasons for failure. A comparison to other metallization schemes on p-GaN is also given.