Chemical etching investigation of polycrystalline p-type 6H-SiC in HF/Na2O2 solutions Review Article

In this work, an experimental study on the chemical etching reaction of polycrystalline p-type 6H-SiC was carried out in HF/Na2O2 solutions. The morphology of the etched surface was examined with varying Na2O2 concentration, etching time, agitation speed and temperature. The surfaces of the etched samples were analyzed using scanning electron microscopy (SEM), energy-dispersive X-ray (EDX) Fourier transform infrared spectroscopy (FT-IR) and photoluminescence. The surface morphology of samples etched in HF/Na2O2 is shown to depend on the solution composition and bath temperature. The investigation of the HF/Na2O2 solutions on 6H-SiC surface shows that as Na2O2 concentration increases, the etch rate increases to reach a maximum value at about 0.5 M and then decreases. A similar behaviour has been observed when temperature of the solution is increased. The maximum etch rate is found for 80 °C. In addition, a new polishing etching solution of 6H-SiC has been developed. This result is very interesting since to date no chemical polishing solution has been developed on the material.