Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification

The introduction of amine groups on the surface of dielectric resins improves the adhesion with electrochemically deposited metals. In this work, etched epoxy resin surfaces are modified with aliphatic amines via a two step wet chemical reaction approach. First, cyanuric chloride is introduced on the surface. Next, the remaining reactive sites of cyanuric chloride are used to couple an aliphatic polyamine. Both reaction steps are optimized by variation of reaction parameters such as concentration, chemicals, temperature and time. A detailed surface characterization after each reaction step is provided using following techniques: ATR-IR, SEM–EDS, XPS and AFM.