• Title of article

    Numerical study of heat pipe application in heat recovery systems

  • Author/Authors

    Song Lin، نويسنده , , John Broadbent، نويسنده , , Ryan McGlen، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2005
  • Pages
    7
  • From page
    127
  • To page
    133
  • Abstract
    Heat pipes are two-phase heat transfer devices with extremely high effective thermal conductivity. They can be cylindrical or planar in structure. Heat pipes can be embedded in a metal cooling plate, which is attached to the heat source, and can also be assembled with a fin stack for fluid heat transfer. Due to the high heat transport capacity, heat exchangers with heat pipes have become much smaller than traditional heat exchangers in handling high heat fluxes. With the working fluid in a heat pipe, heat can be absorbed on the evaporator region and transported to the condenser region where the vapour condenses releasing the heat to the cooling media. Heat pipe technology has found increasing applications in enhancing the thermal performance of heat exchangers in microelectronics, energy and other industrial sectors. Utilisation of a heat pipe fin stack in the drying cycle of domestic appliances for heat recovery may lead to a significant energy saving in the domestic sector. However, the design of the heat pipe heat exchanger will meet a number of challenges. This paper presents a design method by using CFD simulation of the dehumidification process with heat pipe heat exchangers. The strategies of simulating the process with heat pipes are presented. The calculated results show that the method can be further used to optimise the design of the heat pipe fin stack. The study suggests that CFD modelling is able to predict thermal performance of the dehumidification solution with heat pipe heat exchangers.
  • Keywords
    Heat recovery , Dehumidification and drying process , Dishwasher drying system , CFD simulation , Fin assemblies , Heat pipe
  • Journal title
    Applied Thermal Engineering
  • Serial Year
    2005
  • Journal title
    Applied Thermal Engineering
  • Record number

    1026005