The experimental and numerical investigation of a grooved vapor chamber

An effective thermal spreader can achieve more uniform heat flux distribution and thus enhance heat dissipation of heat sinks. Vapor chamber is one of highly effective thermal spreaders. In this paper, a novel grooved vapor chamber was designed. The grooved structure of the vapor chamber can improve its axial and radial heat transfer and also can form the capillary loop between condensation and evaporation surfaces. The effect of heat flux, filling amount and gravity to the performance of this vapor chamber is studied by experiment. From experiment, we also obtained the best filling amount of this grooved vapor chamber. By comparing the thermal resistance of a solid copper plate with that of the vapor chamber, it is suggested that the critical heat flux condition should be maintained to use vapor chamber as efficient thermal spreaders for electronics cooling. A two-dimensional heat and mass transfer model for the grooved vapor chamber is developed. The numerical simulation results show the thickness distribution of liquid film in the grooves is not uniform. The temperature and velocity field in vapor chamber are obtained. The thickness of the liquid film in groove is mainly influenced by pressure of vapor and liquid beside liquid–vapor interface. The thin liquid film in heat source region can enhance the performance of vapor chamber, but if the starting point of liquid film is backward beyond the heat source region, the vapor chamber will dry out easily. The optimal filling ratio should maintain steady thin liquid film in heat source region of vapor chamber. The vapor condenses on whole condensation surface, so that the condensation surface achieves great uniform temperature distribution. By comparing the experimental results with numerical simulation results, the reliability of the numerical model can be verified.