Simulation of kinetically limited growth of electrodeposited polycrystalline Ni films

A kinetic Monte Carlo (KMC) technique was adopted to simulate the growth dynamics of electrodeposited polycrystalline Ni thin films under kinetically limited conditions with a two-dimensional triangle lattice mapping the cross-section of the film. Effects of surface diffusion and surface-energy anisotropy on the microstructures of the plated film such as shape and size of grains, density, surface roughness, and textures were examined. This work focuses on the microstructure evolutions for different deposition parameters (for example, deposition rate and electrolyte temperature). We obtained the growth exponent β=0.46, which characterizes the scaling behavior of this growth. Preferential orientation of 〈1 1 1〉 and 〈1 0 0〉 have been observed at elevated temperature and at elevated deposition rate, respectively. To simulate the evolution of texture, the influence of hydrogen absorption on the surface energy of six main surfaces of nickel was investigated.