Title of article
On thermomechanical properties of Au–Ag–Pd–Cu–Si bulk metallic glass
Author/Authors
T.W. Tang، نويسنده , , Y.C. Chang، نويسنده , , J.C. Huang، نويسنده , , Q. Gao، نويسنده , , J.S.C. Jang، نويسنده , , Chi Y.A. Tsao، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2009
Pages
4
From page
569
To page
572
Abstract
The viscosity behavior and formability of the Au49Ag5.5Pd2.3Cu26.9Si16.3 bulk metallic glass within the supercooled liquid temperature region are examined using thermomechanical analyzer (TMA). The viscosity values of the Au-based BMG within 440–470 K lies within 2 × 107 and 1 × 108 Pa s, a reasonable viscosity level for macro- or micro-forming. The low working temperature of ∼450 K and the low working pressure less than 1 MPa, coupled with the sufficient hardness of ∼350 Hv, stress level of ∼1100 MPa, and anti-oxidation and anti-corrosion capability, would be highly promising for micro-forming or micro-imprinting for the micro-electro-mechanical systems.
Keywords
Amorphous materials , Thermo-mechanical analysis (TMA) , Thermal properties , Thermomechanical effects
Journal title
Materials Chemistry and Physics
Serial Year
2009
Journal title
Materials Chemistry and Physics
Record number
1061816
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