Tensile deformation and fracture behavior of an oxide dispersion strengthened copper alloy

Dispersion strengthened copper has recently emerged as a potentially viable and attractive engineering material for applications requiring high strength, high thermal and electrical conductivities and resistance to softening at elevated temperatures. In this paper, the microstructure, tensile deformation and fracture behavior of an oxide dispersion strengthened copper alloy is examined. The strength of the dispersion strengthened microstructure decreases with an increase in temperature with a concomitant improvement in ductility. The alloy microstructure maintains a high value of yield strength/ultimate tensile strength ratio. The factors contributing to increased strength and the mechanisms governing quasi-static fracture characteristics are examined in light of intrinsic microstructural effects and deformation characteristics of the matrix.