Title of article
Relaxation investigation on durability for terminals of CPU socket connectors
Author/Authors
K.-C. Liao، نويسنده , , C.-C. Chang، نويسنده ,
Issue Information
ماهنامه با شماره پیاپی سال 2009
Pages
4
From page
252
To page
255
Abstract
Terminals of a central processor unit (CPU) socket connector dominate the signal transmissions between the CPU and a motherboard. Contact forces between the terminal of an electronic connector and the corresponding counterparts, generally required to be within a suitable range, are usually strongly related to the quality of the signal transmission. However, the contact force of these terminals could decay gradually due to the stress relaxation effect under the high temperature conditions. In this study, a finite element analysis is conducted to construct relationships between the contact force and the duration period based on the specifications of field life acceleration test (FLAT) and thermal cyclic test (TCT) of the Electronic Industry Association (EIA).
Keywords
Creep , Fatigue , Thermal analysis
Journal title
Materials and Design
Serial Year
2009
Journal title
Materials and Design
Record number
1067973
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