Microscale heat transfer enhancement using thermal boundary layer redeveloping concept

We demonstrated a new silicon microchannel heat sink, composing of parallel longitudinal microchannels and several transverse microchannels, which separate the whole flow length into several independent zones, in which the thermal boundary layer is in developing. The redeveloping flow is repeated for all of the independent zones thus the overall heat transfer is greatly enhanced. Meanwhile, the pressure drops are decreased compared with the conventional microchannel heat sink. Both benefits of enhanced heat transfer and decreased pressure drop ensure the possibility to use “larger” hydraulic diameter of the microchannels so that less pumping power is needed, which are attractive for high heat flux chip cooling. The above idea fulfilled in microscale is verified by a set of experiments. The local chip temperature and Nusselt numbers are obtained using a high resolution Infrared Radiator Imaging system. Preliminary explanation is given on the decreased pressure drop while enhancing heat transfer. The dimensionless control parameter that guides the new heat sink design and the prospective of the new heat sink are discussed.