Three-dimensional laminar flow and heat transfer in a parallel array of microchannels etched on a substrate

Heat transfer and laminar fluid flow in an array of parallel microchannels etched on a silicon substrate with water as the circulating fluid was studied numerically. The fluid region consisted of a microchannel with a hydraulic diameter of 85.6 μm and aspect ratios ranging from 0.10 to 1.0. A constant heat flux of 90 W/cm2 was applied to the y = H face of the computational domain, which simulates thermal energy generation from an integrated circuit. Generalized transport equations were discretized and solved in three dimensions for velocities, pressure, and temperature. The SIMPLE algorithm [S.V. Patankar, Numerical Heat Transfer and Fluid Flow, Hemisphere, New York, 1980] was used to link pressure and velocity fields, and a thermally repeated boundary condition was applied in the lateral direction to model the repeating nature of the geometry. The numerical results for apparent friction coefficient and convective thermal resistance at the channel inlet and exit closely matched the experimental data in the literature for the case of 0.32 aspect ratio. Apparent friction coefficients were found to increase linearly with Reynolds number. Inlet and outlet thermal resistance values monotonically decreased with increasing Reynolds number and increased with aspect ratio.