Electrochemical Fabrication of Low Density Metal Foam with Mono-Dispersed-Sized Micro- and Submicro-Meter Pore

This paper deals with the fabrication of low-density metal using microtemplate and electrochemical plating techniques. Tin and gold foam films were demonstrated. For both cases, porous foam plating required 0.5 V negatively higher bias potential than that for conventional metal plating. The electric current density values for them are smaller than those for bulk metal plating. In spite of these differences, the coulomb efficiency was almost the same as those for bulk metal plating. The density was almost close to the rest of closed packing density; 23 % of bulk metal for gold and 20 % of bulk metal for tin. These low-density foams will be applied for extreme ultraviolet (EUV) generation or other application through laser produced plasma.