• Title of article

    The grain size dependence of flow stress in a Cu–26Ni–17Zn alloy Original Research Article

  • Author/Authors

    S. NAGARJUNA، نويسنده , , M. Srinivas، نويسنده , , K.K. Sharma، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2000
  • Pages
    7
  • From page
    1807
  • To page
    1813
  • Abstract
    The effect of grain size in the range 15–120 μm on flow stress was studied at room temperature to investigate the Hall–Petch relationship in a Cu–26Ni–17Zn alloy. It was found that the Hall–Petch relation is valid for the alloy. The Hall–Petch constants, σoε and kε are related to true strain (ε) in such a way that σoε is proportional to ε and kε to ε1/2. An equation for flow stress as a function of true strain and grain size has been derived from these results. Dislocation density model for grain size strengthening is found valid for this alloy. Solid solution strengthening in the Cu–26Ni–17Zn alloy is attributed to the interaction of nickel and zinc atoms with screw dislocations and the effective interaction is more due to modulus mismatch than size misfit.
  • Keywords
    Copper alloy , Annealing , Grain size , Mechanical properties , Hall–Petch relationship
  • Journal title
    ACTA Materialia
  • Serial Year
    2000
  • Journal title
    ACTA Materialia
  • Record number

    1139525