On the influence of the shape of randomly oriented, non-conducting inclusions in a conducting matrix on the effective electrical conductivity Original Research Article

The influence exerted by the shape of randomly oriented non-conducting inclusions on the electrical conductivity of a metal is investigated using the aluminum–silicon eutectic alloy. By varying the time and temperature of heat treatment after solidification, the shape of the silicon inclusions is varied between plate-like and close-to-spherical. The influence of the geometry of the inclusions on the resistivity of the composite is separated from the influence of varying amounts of silicon in solid solution by centering the analysis on the temperature coefficient of the electrical resistivity rather than on the resistivity itself.