Interfacial morphology development and solute trapping behavior during rapid solidification of an Al–Li–Cu alloy Original Research Article

An aluminum–lithium–copper alloy was rapidly solidified via the electrospark deposition process. High-resolution scanning electron microscopy (HR-SEM), time-of-flight secondary-ion-mass-spectroscopy (TOF-SIMS) and atom probe tomography (APT) were employed to investigate the distribution of solute within the deposited materials. The TOF-SIMS data revealed evidence that solute trapping of lithium occurred during solidification, while SEM and APT revealed the presence of fine copper-rich cells within the microstructure (∼30–60 nm in width). This morphology correlated directly with the microstructural morphology predicted by the Kurz–Giovanola–Trivedi (KGT) model for microstructural development during rapid solidification. The KGT model, which can be used to describe the planar–cellular transition within a microstructure, then predicted a solidification front velocity of ∼1 m s−1 being realized during electrospark deposition solidification. This SFV corroborated the chemical mapping data, and therefore supported the solute trapping hypothesis, as the continuous growth model for solute trapping as developed by Aziz and Kaplan (Acta Metallurgica 1988; 36:2335) predicts significant trapping of lithium at a SFV of 1 m s−1. Finally APT revealed the presence of Al3Li phase upon the copper-rich cell walls. It was then determined that the Al3Li was not formed during solidification, as predicted by a time-dependent nucleation model for phase prediction during rapid solidification, and therefore is the result of a subsequent aging process.