Title of article
Corrigendum to “Ta–Rh binary alloys as a potential diffusion barrier between Cu and Si: Stability and failure mechanism of the Ta–Rh amorphous structures” [Acta Mater. 61 (2013) 5365–5374]
Author/Authors
Neda Dalili، نويسنده , , Qi Liu، نويسنده , , Douglas G. Ivey ، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2014
Pages
1
From page
286
To page
286
Journal title
ACTA Materialia
Serial Year
2014
Journal title
ACTA Materialia
Record number
1147422
Link To Document