Shaking assisted self-assembly of rectangular-shaped parts

A process for shaking assisted self-assembly of rectangular-shaped parts is presented. Rectangular parts are assembled to their corresponding binding sites on a glass substrate in an air environment. Rectangular binding sites are the only hydrophilic areas on the substrate. By a dip-coating process, molten solders wet only the binding sites on the substrate. The parts with misalignment angle up to 90° can be rotated and translated to align with the binding sites during orbital shaking. Before the shaking, the solder is reflowed by heating to 120 °C. The alignment completed within 3 s. The yields of the self-assembly for misalignment angles ranging from 15° to 90° are at least 80%. The integrity of the bonding between the parts and the binding sites is confirmed by a static debonding test.