Title of article
Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads
Author/Authors
Hui Xu، نويسنده , , Changqing Liu، نويسنده , , VADIM V. SILBERSCHMIDT، نويسنده , , Zhong Chen، نويسنده , , Jun Wei، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2010
Pages
8
From page
1035
To page
1042
Abstract
The morphological features of lift-off footprints on the aluminium metallization pads were investigated to gain an understanding of the effects of bonding parameters on formation of initial bonds during thermosonic gold ball bonding. The obtained results showed that metallurgical bonding initiated at the peripheral areas of the contact area situated along the direction of ultrasonic vibration. Those areas extended inwards with an increase in ultrasonic power. Both the external bonded area and central non-bonded area increased with increasing bonding force. Based on the evolution of footprints, the bonding models were proposed, and the effects of the bonding parameters on the formation of initial bonds were discussed.
Keywords
Ultrasonic power , Bonding force , Bonding mechanism , Gold ball bonding , Lift-off footprint
Journal title
Journal of Materials Processing Technology
Serial Year
2010
Journal title
Journal of Materials Processing Technology
Record number
1183873
Link To Document