• Title of article

    Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

  • Author/Authors

    Hui Xu، نويسنده , , Changqing Liu، نويسنده , , VADIM V. SILBERSCHMIDT، نويسنده , , Zhong Chen، نويسنده , , Jun Wei، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2010
  • Pages
    8
  • From page
    1035
  • To page
    1042
  • Abstract
    The morphological features of lift-off footprints on the aluminium metallization pads were investigated to gain an understanding of the effects of bonding parameters on formation of initial bonds during thermosonic gold ball bonding. The obtained results showed that metallurgical bonding initiated at the peripheral areas of the contact area situated along the direction of ultrasonic vibration. Those areas extended inwards with an increase in ultrasonic power. Both the external bonded area and central non-bonded area increased with increasing bonding force. Based on the evolution of footprints, the bonding models were proposed, and the effects of the bonding parameters on the formation of initial bonds were discussed.
  • Keywords
    Ultrasonic power , Bonding force , Bonding mechanism , Gold ball bonding , Lift-off footprint
  • Journal title
    Journal of Materials Processing Technology
  • Serial Year
    2010
  • Journal title
    Journal of Materials Processing Technology
  • Record number

    1183873