Title of article
Relation between mobility factor and diffusion factor for thermoset cure
Author/Authors
Yan Meng، نويسنده , , Sindee L. Simon، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2005
Pages
11
From page
179
To page
189
Abstract
The temperature-modulated differential scanning calorimetry (TMDSC) responses during cure of both epoxy/aromatic amine and dicyanate ester/polycyanurate systems are modeled using chemical reaction kinetics with diffusion control. Physical aging effects are incorporated into the model using the Tool–Narayanaswamy–Moynihan (TNM) equation. We investigate the assumption that the mobility factor, which may be obtained from experimental temperature-modulated differential scanning calorimetry reversing heat flow data, is related to the diffusion factor for the two systems.
Keywords
Thermoset cure , Modulated DSC , TMDSC , Mobility factor , Diffusion factor , Physical aging
Journal title
Thermochimica Acta
Serial Year
2005
Journal title
Thermochimica Acta
Record number
1197043
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