• Title of article

    Relation between mobility factor and diffusion factor for thermoset cure

  • Author/Authors

    Yan Meng، نويسنده , , Sindee L. Simon، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2005
  • Pages
    11
  • From page
    179
  • To page
    189
  • Abstract
    The temperature-modulated differential scanning calorimetry (TMDSC) responses during cure of both epoxy/aromatic amine and dicyanate ester/polycyanurate systems are modeled using chemical reaction kinetics with diffusion control. Physical aging effects are incorporated into the model using the Tool–Narayanaswamy–Moynihan (TNM) equation. We investigate the assumption that the mobility factor, which may be obtained from experimental temperature-modulated differential scanning calorimetry reversing heat flow data, is related to the diffusion factor for the two systems.
  • Keywords
    Thermoset cure , Modulated DSC , TMDSC , Mobility factor , Diffusion factor , Physical aging
  • Journal title
    Thermochimica Acta
  • Serial Year
    2005
  • Journal title
    Thermochimica Acta
  • Record number

    1197043