Title of article
Thermoanalytical characterization of thermoset polymers for chemical mechanical polishing
Author/Authors
A. Tregub، نويسنده , , G. Ng، نويسنده , , J. Sorooshian، نويسنده , , Carol M. Moinpour، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2005
Pages
8
From page
44
To page
51
Abstract
Thermal analytical study of two types of polyurethane-based polishing pads for chemical mechanical planarization (CMP) was conducted using DMA, TMDSC, TMA, and TGA. The pads were subjected to thermal treatments at various temperatures for different time. Based on the results of thermal analysis, recommendations to optimize pad properties were made.
Keywords
Chemical mechanical planarization , Thermal analysis , PAD
Journal title
Thermochimica Acta
Serial Year
2005
Journal title
Thermochimica Acta
Record number
1197079
Link To Document