• Title of article

    Thermal conductivity enhancement of BN/silicone composites cured under electric field: Stacking of shape, thermal conductivity, and particle packing structure anisotropies

  • Author/Authors

    Yuwang Han، نويسنده , , Sumin Lv، نويسنده , , Chanxi Hao، نويسنده , , Fei Ding، نويسنده , , Yi Zhang، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2012
  • Pages
    6
  • From page
    68
  • To page
    73
  • Abstract
    We have prepared thermal conductive silicone rubbers filled with BN micro particles assisted with electric field assisted curing, and studied the electric field effect. The composites structure was characterized by XRD, SEM, and the results indicate that aligned conductive networks have formed between the electrodes under either AC or DC electric fields. Furthermore, the “c” axis of BN particles was found to orient along with the electric field and the orientation degree under AC was higher than that with DC. Upon increasing the filler volume fraction, the orientation decreases dramatically. In addition, we have investigated the thermal conductivity of BN/silicone composites with varying particle volume fractions and electric-field strengths. For example, under the AC electric field (50 Hz) of 11.0 kV/mm, the thermal-conductivity with 20% loading of BN increases by ca. 250% compared to that prepared without electric field. A two-level homogenization model was adopted to analyze and fit the thermal conductivity data.
  • Keywords
    Thermal interface material , Boron nitride , Electric field assisted structuring , Anisotropic thermal conductivity
  • Journal title
    Thermochimica Acta
  • Serial Year
    2012
  • Journal title
    Thermochimica Acta
  • Record number

    1199930