Measurements of heat transfer in microchannel heat sinks

The paper presents new experimental measurements for pressure drop and heat transfer coefficient in microchannel heat sinks. Tests were performed with devices fabricated using standard Silicon 100 wafers. Two different channel patterns were studied. The parallel pattern distributed the fluid through several parallel passages between the inlet and the outlet headers located at two ends of the wafer. The series pattern carried the fluid through a longer winding channel between the inlet and the outlet headers. Channels of different depths (or aspect ratios) were studied. Tests were carried out using water as the working fluid. The fluid flow rate as well as the pressure and temperature of the fluid at the inlet and outlet of the device, and temperature at several locations in the wafer were measured. These measurements were used to calculate local and average Nusselt number and coefficient of friction in the device for different flow rate, channel size, and channel configuration.