Advanced thermal enhancement and management of LED packages

Thermal management of packages consists of external cooling mechanisms, heat dissipaters, and thermal interfaces. While keeping cooling condition constant, junction temperature of LEDs with higher thermal resistance increases more rapidly; hence the luminous efficiency decreases more obviously. This paper includes the discussion about the calculation methods of the lightingʹs heat transfer. The calculation process has been demonstrated by an example of cooling of LEDs lighting in this paper. In particular, the operation package heat transfer enhancement is required by most package manufacturers with a decrease of 20% ~ 30% of the thermal resistance over conventional package geometries.