Temperature distribution of read/write head soldering with ribbon cable of HDD

In the present paper, the temperature distribution of the read/write head soldering with the ribbon cable of the HDD is presented. The soldering of the actuator/connector with the ribbon cable can be performed either by manual or semi-automatic process which has been introduced as one of the manufacturing processes of the HDD. Finite element analysis is applied to analyze the model. The properties of the soldering ball and boundary conditions have significant effects on the thermal stress and localized heat in the soldering process that cause the failure of the ribbon cable of the HDD. The results of this study are of technological importance for the efficient design and/or approval of the soldering HDD process to reduce yield loss of the hard disk drive.