• Title of article

    Electric breakdowns and breakdown mechanisms in ultrathin silicon oxides

  • Author/Authors

    Jackson، J.C. نويسنده , , Oralkan، O نويسنده , , Dumin، D.J. نويسنده , , Brown، G.A. نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1999
  • Pages
    -170
  • From page
    171
  • To page
    0
  • Abstract
    It was found that the breakdown times measured using time-dependent-dielectric-breakdown (TDDB) distributions could be shifted to shorter times when the amount of energy available during the breakdown event was increased. The TDDB distributions were non-unique and breakdown models must account for both electrical breakdowns and dielectric breakdown. A novel approach for obtaining breakdown distributions will be presented. This approach uses a small number of oxides to obtain a time-dependent-electric-breakdown (TDEB) distribution, which will be shown to provide complementary information to that obtained from (TDDB) distributions. While the observation of dielectric breakdown in ultra-thin dielectrics may be difficult using standard test conditions, it will be shown that electric breakdowns are relatively easy to observe.
  • Keywords
    Dynamic thermal modeling of IC packages , Thermal benchmark IC , Measuring of thermal coupling in ICs
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Serial Year
    1999
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Record number

    12861