Title of article
Electric breakdowns and breakdown mechanisms in ultrathin silicon oxides
Author/Authors
Jackson، J.C. نويسنده , , Oralkan، O نويسنده , , Dumin، D.J. نويسنده , , Brown، G.A. نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
-170
From page
171
To page
0
Abstract
It was found that the breakdown times measured using time-dependent-dielectric-breakdown (TDDB) distributions could be shifted to shorter times when the amount of energy available during the breakdown event was increased. The TDDB distributions were non-unique and breakdown models must account for both electrical breakdowns and dielectric breakdown. A novel approach for obtaining breakdown distributions will be presented. This approach uses a small number of oxides to obtain a time-dependent-electric-breakdown (TDEB) distribution, which will be shown to provide complementary information to that obtained from (TDDB) distributions. While the observation of dielectric breakdown in ultra-thin dielectrics may be difficult using standard test conditions, it will be shown that electric breakdowns are relatively easy to observe.
Keywords
Dynamic thermal modeling of IC packages , Thermal benchmark IC , Measuring of thermal coupling in ICs
Journal title
MICROELECTRONICS RELIABILITY
Serial Year
1999
Journal title
MICROELECTRONICS RELIABILITY
Record number
12861
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