Title of article
Validation of radiation hardened designs by pulsed laser testing and SPICE analysis
Author/Authors
Lewis، Bradley D. نويسنده , , Pouget، V. نويسنده , , Lapuyade، H. نويسنده , , Briand، R. نويسنده , , Fouillat، P. نويسنده , , Sarger، L. نويسنده , , Calvet، M.-C. نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
-930
From page
931
To page
0
Abstract
A new pulsed laser system dedicated to the simulation of radiation effects on integrated circuits is presented. On-line testing capabilities are detailed and two SPICE models of radiation induced transient currents are proposed to be used for results analysis. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords
Electromigration , Aluminum alloys , Resistance measurements , Microstructural analysis
Journal title
MICROELECTRONICS RELIABILITY
Serial Year
1999
Journal title
MICROELECTRONICS RELIABILITY
Record number
13046
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