Title of article
Gold removal in Failure Analysis of GaAs-based laser diodes
Author/Authors
M.Vanzi، نويسنده , , A.Bonfiglio، نويسنده , , P.Salaris، نويسنده , , P.Deplano، نويسنده , , E.F.Trogu، نويسنده , , A.Serpe، نويسنده , , Salmini، G. نويسنده , , Palo، R. De نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
-1042
From page
1043
To page
0
Abstract
A great improvement of EBIC images on GaAs-based aged laser diodes is obtained by removing the gold metallization from the top surface. Gold removal, on the other hand, is troublesome and unreliable on aged devices, both under the chemical (I/KJ) or mechanical (peeling) approach. A new etch is presented, reliable for gold dissolution even on aged structures, and selective towards GaAs and its compounds. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords
Microstructural analysis , Aluminum alloys , Resistance measurements , Electromigration
Journal title
MICROELECTRONICS RELIABILITY
Serial Year
1999
Journal title
MICROELECTRONICS RELIABILITY
Record number
13083
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