• Title of article

    Long term Reliability Testing of HV-IGBT modules in worst case traction operation

  • Author/Authors

    Fratelli، L. نويسنده , , Cascone، B. نويسنده , , Giannini، G. نويسنده , , G.Busatto، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1999
  • Pages
    -1136
  • From page
    1137
  • To page
    0
  • Abstract
    High reliability level is required for IGBT modules used in power converters in railway traction application which however are subject to high stress because of the typical cycling operation which causes thermomechanical fatigue. The paper reports about Ansaldo Trasporti activity in IGBTʹs reliability testing. Facility simulating worst case traction operation is described and the result after operation is presented: due to such stressing action, a solder delamination at the baseplate seems to be the first failure mechanism to be excited. © 1999 Elsevier Science Ltd. All rights reserved.
  • Keywords
    Aluminum alloys , Microstructural analysis , Electromigration , Resistance measurements
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Serial Year
    1999
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Record number

    13112