Title of article
Reliability of AIN substrates and their solder joints in IGBT power modules
Author/Authors
Mitic، G. نويسنده , , Beinert، R. نويسنده , , Klofac، P. نويسنده , , Schultz، H. J. نويسنده , , Lefranc، G. نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
-1158
From page
1159
To page
0
Abstract
The reliability of IGBT modules was investigated with respect to the metallized ceramic (substrate) and the solder layer between the substrate and copper baseplate. Thermal cycles were performed between -55°C and +150°C on substrates based on different technologies and from various manufacturers. An incipient delamination of the metallization could be predicted from the mechanical resonance frequency. The warping of the substrates after cycling due to crack propagation and the adhesion of the metallization were determined. Thermal and active-power cycles were performed on 1200 A/ 3.3 kV IGBT power modules to investigate the reliability of the solder joint between substrate and baseplate. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords
Resistance measurements , Aluminum alloys , Electromigration , Microstructural analysis
Journal title
MICROELECTRONICS RELIABILITY
Serial Year
1999
Journal title
MICROELECTRONICS RELIABILITY
Record number
13120
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