Heat load test of beryllium and CuCrZr joints

An improved bonding method by a hot isostatic pressing (HIP) with an interlayer has been developed as the joining technology of Be/CuCrZr that is a candidate material of lTER first wall. In this study, the heat load tests for the HIP joints were carried out for evaluation of the heat removal performance and the durability of these HIP joints. Result of the tests showed an approximately linear relationship between the heat flux and the temperature at the surface of all types mock-ups. The heat removal performances of these improved joints were similar to those of conventional Be/DSCu joints. After the heat load tests, the boundaries of HIP joint were observed by scanning electron microscopy and no crack nor detachment was detected. On the other hand, the surface temperatures of all type mock-ups increase slightly with increasing the cycle number of the heat load.