Title of article
Multilayer thick-film technology as applied to design of microwave devices
Author/Authors
Krasimira Kapitanova، نويسنده , , Polina V. and Simine، نويسنده , , Alexander V. and Kholodnyak، نويسنده , , Dmitry V. and Vendik، نويسنده , , Irina B.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
4
From page
2941
To page
2944
Abstract
Possibilities of the sandwich multilayer technology to design microwave integrated circuits are discussed. Original designs of various passive microwave devices realized as multilayer sandwich structures are presented. Experimental results confirmed a good potential of the sandwich technology to design high-performance multilayer microwave integrated circuits.
Keywords
Microwave integrated circuits (MICs)
Journal title
Journal of the European Ceramic Society
Serial Year
2007
Journal title
Journal of the European Ceramic Society
Record number
1408924
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