Microstructure and mechanical strength of transient liquid phase bonded Ti3SiC2 joints using Al interlayer

Based on the structure characteristic of Ti3SiC2 and the easy formation of Ti3Si1−xAlxC2 solid solution, a transient liquid phase (TLP) bonding method was used for bonding layered ternary Ti3SiC2 ceramic via Al interlayer. Joining was performed at 1100–1500 °C for 120 min under a 5 MPa load in Ar atmosphere. SEM and XRD analyses revealed that Ti3Si(Al)C2 solid solution rather than intermetallic compounds formed at the interface. The mechanism of bonding is attributed to aluminum diffusing into the Ti3SiC2. The strength of joints was evaluated by three point bending test. The maximum flexural strength reaches a value of 263 ± 16 MPa, which is about 65% of that of Ti3SiC2; for the sample prepared under the joining condition of 1500 °C for 120 min under 5 MPa. This flexural strength of the joint is sustained up to 1000 °C.