Electroless multilayer coatings on aluminium–silicon carbide composites for electronics packaging

Present research studies the deposition of electrical conductive coatings on aluminium matrix composites that have 75 vol% of SiC particles (AlSiC composites) to be used for electronics packaging. Ni(P)–Au multilayer coatings were produced by electroless plating, and continuous and well adhered coatings have been developed. Coatings were characterised using microstructural and micromechanical techniques (microhardness and nanoindentation). Corrosion tests in aggressive environments were also applied to analyse the durability of the coatings under extreme service conditions.