Characterization of the chemical bond in novel materials by the study of the acoustic signature

Acoustic signature is processed by using focalized high frequency acoustic sensors. Through the knowledge of surface wave velocities, very sensitive to the material features, it provides local quantitative information on the elastic properties. This information was related to the chemical bonds in a-SiC:H thin films, in SiC/SiC minicomposites, in cross-linked photopolymers and at an aluminum/poly(ethylene terephtalate) (PET) interface.