A novel methodology for the manufacturability of robust CMOS semiconductor gas sensor arrays

A methodology of fabrication of silicon micromachined structures is presented, that allows the integration of low power and robust substrates for gas sensor array systems. The structure is based on the combination of bulk micromachined wafers anodically bonded to structured glass substrates. The thermal isolation achieved allows on-chip integration of high and low temperature areas for gas sensing materials and CMOS electronics, respectively.