Title of article
Theoretical study of mechanical behavior of thin circular film adhered to a flat punch
Author/Authors
Jin، نويسنده , , Congrui، نويسنده ,
Issue Information
ماهنامه با شماره پیاپی سال 2009
Pages
9
From page
481
To page
489
Abstract
In this paper we present a theoretical study of the cylindrical punch test where a thin circular film clamped at the periphery is adhered to the planar surface of a rigid cylindrical punch, and an external tensile load is applied to the punch causing the film to delaminate from the substrate. We obtain analytical solutions to the deflection of the membrane in the asymptotic limit of large or small loads, and then combine the bending and stretching effects using a lumped parameter force–deflection model. An equilibrium theory of delamination mechanics is derived based on energy balance. The cases of initially stress-free and prestressed film are analyzed, which ought to have significant implications in many technological situations.
Keywords
Adhesion , Plate , energy release rate , Large deflection , Residual stress
Journal title
International Journal of Mechanical Sciences
Serial Year
2009
Journal title
International Journal of Mechanical Sciences
Record number
1422747
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