• Title of article

    Theoretical study of mechanical behavior of thin circular film adhered to a flat punch

  • Author/Authors

    Jin، نويسنده , , Congrui، نويسنده ,

  • Issue Information
    ماهنامه با شماره پیاپی سال 2009
  • Pages
    9
  • From page
    481
  • To page
    489
  • Abstract
    In this paper we present a theoretical study of the cylindrical punch test where a thin circular film clamped at the periphery is adhered to the planar surface of a rigid cylindrical punch, and an external tensile load is applied to the punch causing the film to delaminate from the substrate. We obtain analytical solutions to the deflection of the membrane in the asymptotic limit of large or small loads, and then combine the bending and stretching effects using a lumped parameter force–deflection model. An equilibrium theory of delamination mechanics is derived based on energy balance. The cases of initially stress-free and prestressed film are analyzed, which ought to have significant implications in many technological situations.
  • Keywords
    Adhesion , Plate , energy release rate , Large deflection , Residual stress
  • Journal title
    International Journal of Mechanical Sciences
  • Serial Year
    2009
  • Journal title
    International Journal of Mechanical Sciences
  • Record number

    1422747