The effectiveness of thermal treatment for development of conductive metalized aramid fiber using supercritical fluid carbon dioxide—Fiber–metal adhesive strength improvement

The effect of thermal treatment to improve the metal adhesion into poly-(p-phenylene terephthalamide) (PPTA), e.g. aramid fiber, has been investigated. After palladium(II)-hexafluoroacetylacetonate metal complex, Pd(hfac)2, seeding into the fiber using supercritical fluid carbon dioxide, scCO2, a post-thermal treatment was conducted. As a result, after carrying out electroless copper plating, the adhesive strength between polymer substrate and copper layer greatly increased. Also, in order to have a better comprehension on decomposition reactions of Pd(hfac)2 under supercritical conditions, remains of metal complex were analyzed using electron ionization mass spectrometry technique (EI-MS). EI-MS mass spectra derived from Pd(hfac)2 gave us useful information about its dissociation reactions and reaction temperature under supercritical conditions. Additionally, to verify the Pd particles seeding in the fiber surface, X-ray photoelectron spectrometry (XPS) analyses were performed. The results confirmed that post-thermal treatment induced Pd particles diffusion and deeper penetration of Pd complex and its fragments into the fiber.