An empirical approach to explain the material removal rate for copper chemical mechanical polishing

In this paper, an empirical expression was deduced based on the experimental data for material removal rate of copper chemical mechanical polishing. The parameters of this expression includes the initial chemical corrosion rate(MRR0), the corrosion inhibition efficiency(k) and the mechanical abrading rate(MRRM). The deduced empirical expression revealed that under certain slurry systems, the corrosion inhibition efficiency may always keep unchanged, which may be useful to characterize the inhibition properties of different inhibitors.