Molecular dynamics investigation of patterning via cold welding

We perform a series of molecular dynamics simulations of a subtractive cold-welding patterning process. The effects of film thickness and work of adhesion between the thin film and substrate are examined. For small works of adhesion, the film elastically debonds from the substrate before the onset of plastic deformation inside the film during stamp retraction. A simple model is proposed to describe the debonding and deformation of the film. The model provides an analytical framework that describes the playoff between adhesion, yield strength, and film thickness in determining the debond length of the film induced by stamp retraction.