Polishing of single point diamond tool based on thermo-chemical reaction with copper

This paper describes a new polishing method for diamond cutting tools. The method is based on the principle of oxidization of copper and deoxidization of copper oxide by carbon. A diamond tool was brought into contact with a copper plate, heated in air to a range of 323–523 K. The depth of the removed layer of diamond increased almost linearly with contact time and reached approximately 7 nm after 6 h. In this erosion process, pre-existing microcracks on the diamond surface were reduced. In comparison with the mechanically polished tool, the thermo-chemically polished tool was highly resistant to chipping and yielded a significant rise in tool life.