Title of article
Experimental determination of thermal conductivity and solid–liquid interfacial energy of solid Ag3Sn intermetallic in the Sn–Ag–In ternary alloy
Author/Authors
Ocak، نويسنده , , Y. and Aks?z، نويسنده , , S. and Mara?l?، نويسنده , , N. and Ke?lio?lu، نويسنده , , K.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2010
Pages
9
From page
2250
To page
2258
Abstract
The equilibrated grain boundary groove shapes of a solid Ag3Sn in equilibrium with a Sn–Ag–In eutectic liquid have been observed from a quenched sample with a radial heat flow apparatus. The Gibbs–Thomson coefficient, solid–liquid interfacial energy and grain boundary energy of solid Ag3Sn have been determined from the observed grain boundary groove shapes. The variation of thermal conductivity with temperature for solid Ag3Sn has been measured up to 5 K below the melting temperature with a radial heat flow apparatus. The ratio of thermal conductivity of equilibrated Sn–Ag–In eutectic liquid to solid Ag3Sn has also been measured with a Bridgman-type growth apparatus at the melting temperature.
Keywords
A. Intermetallics , B. Thermal properties , C. Crystal growth , D. Grain boundaries , Structure , E. Physical properties
Journal title
Intermetallics
Serial Year
2010
Journal title
Intermetallics
Record number
1504874
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