Title of article
Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing
Author/Authors
Haseeb، نويسنده , , A.S.M.A. and Leng، نويسنده , , Tay See، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2011
Pages
6
From page
707
To page
712
Abstract
Effects of Co nanoparticle additions to Sn–3.8Ag–0.7Cu on the structure of solder/copper interface have been studied after reflow and high temperature ageing (150 °C, up to 1008 h). Results show that the Co nanoparticles substantially suppress the growth of Cu3Sn but enhance Cu6Sn5 growth. Cobalt nanoparticles reduce interdiffusion coefficient in Cu3Sn. It is suggested that the Co nanoparticles undergo surface dissolution during reflow and exert their influence, at least partially, through alloying effect.
Keywords
B. Diffusion , D. Phase interfaces , A. Composites , F. Scanning tunneling electron microscopy , A. Intermetallics
Journal title
Intermetallics
Serial Year
2011
Journal title
Intermetallics
Record number
1505013
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