Title of article
Surface termination and hydrogen bubble adhesion on Si(1 0 0) surfaces during anisotropic dissolution in aqueous KOH
Author/Authors
Haiss، نويسنده , , Wolfgang and Raisch، نويسنده , , Philipp and Bitsch، نويسنده , , Lennart and Nichols، نويسنده , , Richard J. and Xia، نويسنده , , Xinghua and Kelly، نويسنده , , John J. and Schiffrin، نويسنده , , David J.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
12
From page
1
To page
12
Abstract
The formation and growth of hydrogen bubbles on a Si(1 0 0) surface during its anisotropic etching in aqueous KOH has been investigated. Quantitative data on bubble size, lifetime and density on the etching surface was obtained and their dependence on KOH concentration, applied potential and temperature were measured. In situ FTIR measurements demonstrated a strong dependence of bubble attachment on surface termination and hence on the hydrophilicity of the Si(1 0 0) surface during etching. The formation of surface defects and the geometry of bubble imprints have been directly characterised with scanning probe microscopy. The analysis of hillock formation and statistical considerations show that the adhesion of hydrogen bubbles during anisotropic etching of silicon is a source of surface roughness and pyramid formation.
Keywords
silicon etching , Bubble adhesion , Si(1 , FTIR SPECTROSCOPY , Micromachining , 0 , Hillock formation , 0) , Anisotropic etching
Journal title
Journal of Electroanalytical Chemistry
Serial Year
2006
Journal title
Journal of Electroanalytical Chemistry
Record number
1672630
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