Thermodynamic–kinetic simulation of solidification in binary fcc copper alloys with calculation of thermophysical properties

A thermodynamic–kinetic model is presented for the simulation of phase change and solute redistribution during solidification of binary, one-solid-phase (fcc) copper alloys containing Ag, Al, Ni, P, Sn or Zn. Depending on the alloy composition, the cooling rate and the dendrite arm spacing, the model determines the phase fractions and compositions during solidification. In addition, it calculates important thermophysical material properties (enthalpy, specific heat, thermal conductivity, density and viscosity) from the liquid state down to room temperature. These data are important input data for other models, such as heat transfer and thermal stress models, whose reliability has become more and more dependent on the input data itself. The model is validated comparing calculated results with experimental data of literature.