Title of article
Thermal stress-induced thermoplastic composite debonding, studied by contact electrical resistance measurement
Author/Authors
Mei، نويسنده , , Yu-Zhen and Chung، نويسنده , , D.D.L، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2000
Pages
5
From page
135
To page
139
Abstract
Thermal stress-induced debonding of polyphenylenesulfide from polyphenylenesulfide was studied nondestructively by measurement of the contact electrical resistance between members containing continuous unidirectional carbon fibers at 90°. The resistance increased by up to 600% upon debonding. The resistance increase was much greater than the resistance decrease during prior bonding. Debonding occurred during cooling when the pressure or temperature during prior bonding was not sufficiently high.
Keywords
B. Composites , thermoplastic , Polyphenylenesulfide , Debonding , Thermal Stress , Electrical resistance
Journal title
International Journal of Adhesion and Adhesives
Serial Year
2000
Journal title
International Journal of Adhesion and Adhesives
Record number
1697392
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