Title of article
A novel blister test to investigate thin film delamination at elevated temperature
Author/Authors
Wan ، نويسنده , , Kai-Tak، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2000
Pages
3
From page
141
To page
143
Abstract
A fixed amount of air was trapped at the interface of a rigid substrate and its coating. Blistering was initially constrained upon heating by a large external load until a desired temperature was reached. The load was then removed, causing a stable lenticular crack. The new method can be used to investigate delamination at elevated temperature.
Keywords
blister test , TMA , Delamination , Thin film , Adhesion
Journal title
International Journal of Adhesion and Adhesives
Serial Year
2000
Journal title
International Journal of Adhesion and Adhesives
Record number
1697394
Link To Document