Title of article
Adhesive compliance effect in mode I separation: Profilometry approach
Author/Authors
Budzik، نويسنده , , M. and Jumel، نويسنده , , J. and Shanahan، نويسنده , , M.E.R.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2011
Pages
11
From page
135
To page
145
Abstract
The effect of adhesive compliance on the deflection of a loaded, bonded beam was studied using laser profilometry. Experimental data obtained were compared with both Euler–Bernoulli (encastré) and Winkler (one parameter elastic foundation) models. A third, analytical, 2D model, based on shear within the adhesive layer (two parameter elastic foundation), was introduced. Finite element analysis (FEA) was also used to study the effect of adhesive compliance parallel to the bondline. Although the Winkler model already gives good correlation, both the analytical 2D and FEA models proposed were found to be in excellent agreement with experimental results, indicating that adhesive shearing rigidity should be taken into account. We present experimental evidence of the adhesive compliance effect when mode I loading is applied.
Keywords
Stress analysis , Wedge tests , fracture , Joint design
Journal title
International Journal of Adhesion and Adhesives
Serial Year
2011
Journal title
International Journal of Adhesion and Adhesives
Record number
1699304
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