• Title of article

    Adhesive compliance effect in mode I separation: Profilometry approach

  • Author/Authors

    Budzik، نويسنده , , M. and Jumel، نويسنده , , J. and Shanahan، نويسنده , , M.E.R.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2011
  • Pages
    11
  • From page
    135
  • To page
    145
  • Abstract
    The effect of adhesive compliance on the deflection of a loaded, bonded beam was studied using laser profilometry. Experimental data obtained were compared with both Euler–Bernoulli (encastré) and Winkler (one parameter elastic foundation) models. A third, analytical, 2D model, based on shear within the adhesive layer (two parameter elastic foundation), was introduced. Finite element analysis (FEA) was also used to study the effect of adhesive compliance parallel to the bondline. Although the Winkler model already gives good correlation, both the analytical 2D and FEA models proposed were found to be in excellent agreement with experimental results, indicating that adhesive shearing rigidity should be taken into account. We present experimental evidence of the adhesive compliance effect when mode I loading is applied.
  • Keywords
    Stress analysis , Wedge tests , fracture , Joint design
  • Journal title
    International Journal of Adhesion and Adhesives
  • Serial Year
    2011
  • Journal title
    International Journal of Adhesion and Adhesives
  • Record number

    1699304