Preparation and performance of a heat-resistant organic adhesive obtained via a liquid SiC precursor

A heat-resistant organic adhesive rich in active SiH bonds and CHCH2 bonds has been synthesized by modifying polymethylsilane with D4Vi. The structure and properties of the adhesive have been investigated by FTIR, GPC, TGA, XRD, bonding strength tests, and SEM. The results show that the obtained adhesive exhibits outstanding thermal stability and bonding properties. The ceramic yields of the adhesive treated in Ar or in air at up to 1200 °C were measured as 81% and 90.6%, respectively. The adhesive can maintain an amorphous state even when heat-treated at 1200 °C for 2 h in air. The room temperature shear strength of the adhesive was measured as 14.9 MPa, and this increased to a maximum value of 31.7 MPa after heat-treatment at 1000 °C for 2 h.